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DM Diamond Wafering Blade

Material: Diamond Particle
Bond: Stainless Steel
Application: For very hard or brittle materials, glass ceramics.stone.
Availability:
Quantity:

Product Description

Material: Diamond Particle

Bond: Stainless Steel

Application: For very hard or brittle materials, glass ceramics.stone.

Code

Specification(mm)
Diameter*Thickness*Arbor

Package

DM100313

100x0.3x12.7

10PCS

DM130413

125x0.4x12.7

10PCS

DM150513

150x0.5x12.7

10PCS

DM180713

175x0.7x12.7

10PCS

DM200922

200x0.9x22

10PCS

DM200932

200x0.9x32

10PCS

DM250932

254x0.9x32

10PCS

DM301532

300x1.5x32

10PCS

DM352032

350x2.0x32

10PCS



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