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Common Polishing Reagents

Views: 0     Author: Site Editor     Publish Time: 2025-02-21      Origin: Site

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Common Polishing Reagents










Common Polishing Reagents

Diamond Suspension

Diamond suspension is a mixture that suspends diamond micro-powder in a liquid. It is mainly composed of diamond particles ranging from the nanometer to micrometer scale and a specific liquid medium (such as water, alkyl alcohol, or other solvents).
Quality Judgment Criteria
l Quality of diamond particles
l Stability of the suspension
lProcessing effect
l Environmental friendliness
Common Solvent Types
lWater: In the preparation of various diamond suspensions, water is a common solvent. Especially in some suspensions that require high dispersibility and stability, by adjusting the pH value and electrical conductivity of water, and adding modifiers and suspending agents, the dispersibility of diamond particles in the solvent can be significantly improved.
lAlkyl Alcohol: Alkyl alcohol is also a commonly used class of solvents. They have good solubility and stability and can effectively disperse diamond particles. The specific types of alkyl alcohol may vary depending on the specific application and performance requirements of the suspension.
Differences between Single Crystal and Polycrystal
lSingle Crystal MonoDia:
 Application Scenarios: Coarse Polishing, Medium Polishing (for rapid material removal)
 High cutting efficiency, low cost
 Low recycling value, cannot be reused after being broken
lPolycrystal PolyDia:
   Application Scenarios: Fine Polishing, Ultra-fine Polishing (pursuing surface quality)
  Low surface damage, high-precision morphology control, high cost
  High recycling value, can be recycled multiple times


Diamond Suspension, Alumina Suspension, Silica Suspension

Parameter

Diamond Suspension

Alumina Suspension

Silica Suspension

Cost

Extremely high, suitable for high-end precision machining

 

Moderate, suitable for large-scale industrial applications

Low, widely used in the biomedical and semiconductor industries

General Particle Size Range

0.1-50μm (mainly in the micrometer range)

50nm-5μm

10-200nm (mainly in the nanometer range)

Polishing Speed and Scenarios

Relatively fast, suitable for coarse and fine polishing

Moderate, suitable for medium-precision polishing

Relatively slow, suitable for precision polishing

Applicable Process Temperature

Stable at high temperatures (>1000°C)

 

Stable at high temperatures (>1500°C)

At room temperature to medium temperature (<300°C)

 

Core Industries

Superhard material processing, precision optics

Metal processing, metallographic analysis

Semiconductor manufacturing, optoelectronics


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