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Views: 0 Author: Site Editor Publish Time: 2025-01-26 Origin: Site
| Before starting the MPress Manual Metallographic Mounting Press, it is essential to comprehensively and thoroughly study all relevant safety regulations. Strictly abiding by safety guidelines is the core element to ensure the smooth operation process and safeguard the safety of personnel and the integrity of the equipment. Do not take it lightly. Next, please strictly follow the following steps for standardized operation: Pre - operation Preparation: 1、First, select a workbench with sufficient rigidity and stability. Its natural frequency should be far away from the vibration frequency of the grinding and polishing machine during operation to effectively avoid the influence of resonance phenomena on the grinding and polishing accuracy. Place the grinding and polishing machine firmly on the workbench. Conduct a comprehensive inspection of the sample to be tested. Use a surface roughness tester to preliminarily detect the surface roughness of the sample. If there are contaminants on the surface, such as dust, oil stains, or oxide layers, use anhydrous ethanol in combination with an ultrasonic cleaning device for deep cleaning to ensure that the surface cleanliness of the sample meets the requirements of the grinding and polishing process. According to the geometric shape, dimensional tolerance, and material characteristics of the sample, select a suitable fixture from the supporting series of fixtures. Through the six - point positioning principle, use high - precision bolts or magnetic adsorption devices to firmly fix the sample on the workbench of the grinding and polishing machine, ensuring that the sample has no displacement or deformation during the grinding and polishing process and guaranteeing the consistency and accuracy of grinding and polishing. 2、Installation of Grinding and Polishing Consumables: Open the consumable installation device of the work disk of the grinding and polishing machine. According to the different stages of the grinding and polishing process, accurately select appropriate grinding and polishing consumables. In the rough - grinding stage, select silicon carbide sandpaper with a relatively large particle size, usually in the range of 80 - 240 mesh, to efficiently remove the machining allowance and macroscopic defects on the sample surface. When entering the fine - grinding stage, replace it with alumina sandpaper with a particle size of 400 - 1200 mesh to further refine the surface roughness. In the fine - polishing stage, use special polishing cloths, such as flannel or silk cloth, and match them with corresponding polishing pastes, such as diamond polishing paste or cerium oxide polishing paste. When installing consumables, use special adhesives or vacuum adsorption devices to ensure that the sandpaper or polishing cloth is closely and evenly attached to the surface of the work disk, eliminating any wrinkles or bubbles and preventing scratches or flatness deviations on the grinding and polishing surface due to improper consumable installation.3、Equipment Debugging: Connect the power supply of the grinding and polishing machine and press the start button. Under the no - load operation state of the equipment, closely observe the operation of the work disk. Use a vibration analyzer to monitor the vibration amplitude and frequency of the work disk to ensure that they are within the specified allowable range. At the same time, listen to the operation sound of the equipment to determine whether there are abnormal mechanical friction sounds or abnormal noises of loose components. According to the material hardness and organizational structure of the sample, refer to the parameter recommendation table in the operation manual of the grinding and polishing machine to accurately adjust the rotation speed and pressure of the grinding and polishing machine. For non - ferrous metal materials with lower hardness, such as pure aluminum or pure copper, the rotation speed can be set at 100 - 200 revolutions per minute, and the pressure can be controlled at 0.1 - 0.3MPa. For alloy steel or cemented carbide materials with higher hardness, the rotation speed can be increased to 300 - 500 revolutions per minute, and the pressure can be adjusted to 0.3 - 0.5MPa. 4、Start Grinding and Polishing: After the equipment is debugged and the sample is firmly fixed, start the grinding and polishing operation. Gently place the sample on the surface of the high - speed rotating grinding and polishing consumables, keep the sample perpendicular to the surface of the consumables to ensure uniform contact, and apply a stable and continuous pressure. The pressure variation range should be controlled within ±5% of the set value to avoid uneven wear on the grinding and polishing surface caused by pressure fluctuations. In the rough - grinding stage, the main purpose is to remove the machining damage layer and uneven parts on the sample surface. Appropriate pressure can be increased to maintain a relatively high grinding and polishing rate. After the rough - grinding is completed, switch to the fine - grinding process, gradually reduce the pressure, and at the same time reduce the grinding and polishing rate to reduce surface scratches and micro - defects. Finally, enter the fine - polishing stage, further reduce the pressure, and with the lubrication and chemical action of the polishing paste, make the sample surface reach a mirror - like finish. During the grinding and polishing process, regularly use an optical microscope or a roughness tester to detect the surface of the sample and monitor the grinding and polishing effect in real - time. 5、Cleaning and Inspection: After the grinding and polishing are completed, carefully remove the sample and place it in an ultrasonic cleaning machine. Use a special metallographic cleaning agent for cleaning to thoroughly remove the remaining grinding debris, polishing paste, and other contaminants on the surface. After cleaning, rinse the sample with deionized water and dry it with clean nitrogen. Use an atomic force microscope (AFM) or a scanning electron microscope (SEM) to conduct a microscopic inspection of the sample surface, evaluate the surface roughness, flatness, and microscopic organizational structure to ensure that the expected metallographic preparation requirements are met. If there are defects on the surface or the ideal finish is not achieved, select an appropriate grinding and polishing process for local repair or re - grinding and polishing according to the specific situation. 6、Equipment Cleaning and Shutdown: Remove the used sandpaper and polishing cloth from the work disk of the grinding and polishing machine. Use special cleaning tools to clean the remaining grinding debris and polishing paste on the surface of the work disk, and then wipe the work disk and the equipment housing with alcohol to remove oil stains and impurities. Turn off the power supply of the grinding and polishing machine, return the operation handles, control buttons, and other components of the equipment to their initial states, and prepare for the next use. At the same time, regularly conduct a comprehensive maintenance of the grinding and polishing machine, including checking the wear of transmission components, the working state of the lubrication system, and the safety of the electrical system to ensure that the equipment is always in good operating condition. |
